LFXP2-17E CPLD芯片解密服務(wù)商——深圳市維動(dòng)智芯科技有限公司，聯(lián)系電話：13717069599
我公司成功破解了Lattice CPLD芯片，此款芯片年份較久，客人在維修設(shè)備時(shí)對(duì)此有需求，應(yīng)客戶要求，對(duì)此款芯片進(jìn)行破解。
我司在眾多研究領(lǐng)域均擁有豐富研究成果，能夠提供多達(dá)四十余廠家的數(shù)萬(wàn)種型號(hào)的芯片解密服務(wù)
以下是此款芯片的主要特性及技術(shù)參數(shù)。具體引腳定義及具體信息，可聯(lián)系我們索取、
Features
flexiFLASH™ Architecture
• Instant-on
• Infinitely reconfigurable
• Single chip
• FlashBAK™ technology
• Serial TAG memory
• Design security
Live Update Technology
• TransFR™ technology
• Secure updates with 128 bit AES encryption
• Dual-boot with external SPI
sysDSP™ Block
• Three to eight blocks for high performance
Multiply and Accumulate
• 12 to 32 18x18 multipliers
• Each block supports one 36x36 multiplier or four
18x18 or eight 9x9 multipliers
Embedded and Distributed Memory
• Up to 885 Kbits sysMEM™ EBR
• Up to 83 Kbits Distributed RAM
sysCLOCK™ PLLs
• Up to four analog PLLs per device
• Clock multiply, divide and phase shifting
Flexible I/O Buffer
• sysIO™ buffer supports:
– LVCMOS 33/25/18/15/12; LVTTL
– SSTL 33/25/18 class I, II
– HSTL15 class I; HSTL18 class I, II
– PCI
– LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS
Pre-engineered Source Synchronous
Interfaces
• DDR / DDR2 interfaces up to 200 MHz
• 7:1 LVDS interfaces support display applications
• XGMII
Density And Package Options
• 5k to 40k LUT4s, 86 to 540 I/Os
• csBGA, TQFP, PQFP, ftBGA and fpBGA packages
• Density migration supported
Flexible Device Configuration
• SPI (master and slave) Boot Flash Interface
• Dual Boot Image supported
• Soft Error Detect (SED) macro embedded
System Level Support
• IEEE 1149.1 and IEEE 1532 Compliant
• On-chip oscillator for initialization & general use
• Devices operate with 1.2V power supplyFeatures
 
flexiFLASH™ Architecture
• Instant-on
• Infinitely reconfigurable
• Single chip
• FlashBAK™ technology
•Serial TAG memory
•Design security
Live Update Technology
• TransFR™ technology
• Secure updates with 128 bit AES encryption
• Dual-boot with external SPI
sysDSP™ Block
• Three to eight blocks for high performance
Multiply and Accumulate
• 12 to 32 18x18 multipliers
• Each block supports one 36x36 multiplier or four
18x18 or eight 9x9 multipliers
Embedded and Distributed Memory
• Up to 885 Kbits sysMEM™ EBR
• Up to 83 Kbits Distributed RAM
sysCLOCK™ PLLs
• Up to four analog PLLs per device
• Clock multiply, divide and phase shifting
Flexible I/O Buffer
• sysIO™ buffer supports:
– LVCMOS 33/25/18/15/12; LVTTL
– SSTL 33/25/18 class I, II
– HSTL15 class I; HSTL18 class I, II
–PCI
– LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS
Pre-engineered Source Synchronous
Interfaces
• DDR / DDR2 interfaces up to 200 MHz
• 7:1 LVDS interfaces support display applications
•XGMII
Density And Package Options
• 5k to 40k LUT4s, 86 to 540 I/Os
• csBGA, TQFP, PQFP, ftBGA and fpBGA packages
• Density migration supported
Flexible Device Configuration
• SPI (master and slave) Boot Flash Interface
• Dual Boot Image supported
• Soft Error Detect (SED) macro embedded
System Level Support
• IEEE 1149.1 and IEEE 1532 Compliant
• On-chip oscillator for initialization & general use
• Devices operate with 1.2V power supplyFeatures
 
flexiFLASH™ Architecture
• Instant-on
• Infinitely reconfigurable
• Single chip
• FlashBAK™ technology
•Serial TAG memory
•Design security
Live Update Technology
• TransFR™ technology
• Secure updates with 128 bit AES encryption
• Dual-boot with external SPI
sysDSP™ Block
• Three to eight blocks for high performance
Multiply and Accumulate
• 12 to 32 18x18 multipliers
• Each block supports one 36x36 multiplier or four
18x18 or eight 9x9 multipliers
Embedded and Distributed Memory
• Up to 885 Kbits sysMEM™ EBR
• Up to 83 Kbits Distributed RAM
sysCLOCK™ PLLs
• Up to four analog PLLs per device
• Clock multiply, divide and phase shifting
Flexible I/O Buffer
• sysIO™ buffer supports:
– LVCMOS 33/25/18/15/12; LVTTL
– SSTL 33/25/18 class I, II
– HSTL15 class I; HSTL18 class I, II
–PCI
– LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS
Pre-engineered Source Synchronous
Interfaces
• DDR / DDR2 interfaces up to 200 MHz
• 7:1 LVDS interfaces support display applications
•XGMII
Density And Package Options
• 5k to 40k LUT4s, 86 to 540 I/Os
• csBGA, TQFP, PQFP, ftBGA and fpBGA packages
• Density migration supported
Flexible Device Configuration
• SPI (master and slave) Boot Flash Interface
• Dual Boot Image supported
• Soft Error Detect (SED) macro embedded
System Level Support
• IEEE 1149.1 and IEEE 1532 Compliant
• On-chip oscillator for initialization & general use
• Devices operate with 1.2V power supply